TSMC (Taiwan Semiconductor Manufacturing) announced on August 21 that it has commenced producing chips using 0.13-micron embedded flash process technology. This new process technology is compatible not only with earlier generations but also with TSMC's 0.13-micron general-purpose and low-power logic processes. The 0.13-micron process is suitable for use in a variety of portable electronic devices, such as ZigBee/Wibree devices, wireless headsets, hearing aids, SmartCards, and other applications requiring low operating voltages.